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available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x3c19e2-20 rev c 20 db directional coupler description the X3C19E2-20S is a low profile, high performance 20db directional coupler in a new easy to use, manufacturing friendly surface mount package. it is designed for dcs, pcs, wcdma and lte band applications. the X3C19E2-20S is designed particularly for power and frequency detection, as well as for vswr monitoring, where tightly controlled coupling and low insertion loss is required. it can be used in high power applications up to 225 watts. parts have been subjected to rigoro us qualification testing and they are manufactured using materials with coefficients of thermal expansion (cte) compatible with co mmon substrates such as fr4, g-10, rf-35, ro4003 and polyimide. produced with 6 of 6 rohs compliant tin immersion finish electrical specifications ** frequency mean coupling insertion loss vswr directivity mhz db db max max : 1 db min 1400-2700 20.3 1.00 0.10 1.22 20 1805-1880 20.2 0.60 0.05 1.12 25 1930-1990 20.0 0.60 0.05 1.12 25 2110-2170 20.0 0.60 0.05 1.12 25 frequency sensitivity power jc operating temp. db max avg. cw watts oc/watt oc 1.00 225 20 -55 to +95 0.05 225 20 -55 to +95 0.05 225 20 -55 to +95 features: ? 1400-2700 mhz ? dcs, pcs, wcdma and lte ? high power ? very low loss ? tight coupling ? high directivity ? production friendly ? tape and reel ? lead free 0.05 225 20 -55 to +95 *estimated, not actual performance **specification based on performance of unit properly inst alled on anaren test board 58493-0001. refer to specifications subject to change without notice. refer to parameter definitions for details. mechanical outline dimensions are in inches [millimeters] tolerances are non-cumulative X3C19E2-20S mechanical outline .560 .010 [14.22 0.25 ] .200 .010 [5.08 0.25 ] .075 .015 [1.91 0.38 ] 4x .025 .004 [0.64 0.10 ] 4x .025 .004 [0.64 0.10 ] 4x.049 .004 sq [1.24 0.10 ] .450 .004 [11.43 0.10 ] .090 .004 [2.29 0.10 ] pin 1 pin 2 pin 4 pin 3 gnd denotes array number pin 1 pin 2 pin 3 pin 4 gnd orientation marker denotes pin 1
model X3C19E2-20S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. directional coupler pin configuration the X3C19E2-20S has an orientation marker to denote pin 1. once port one has been identified the other ports are known automatically. please see the chart below for clarification: 20db coupler pin configuration pin 1 pin 2 pin 3 pin 4 input direct isolated coupled direct input coupled isolated note: the direct port has a dc connection to the inpu t port and the coupled port has a dc connection to the isolated port. for optimum performance use pin 1 or pin 2 as inputs. for optimum il and power handling performance, use pin 1 or pin 2 as inputs
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x3c19e2-20 rev c insertion loss and power derating curves typical insertion loss derating curve for x3c19e2-20 -0.09 -0.08 -0.07 -0.06 -0.05 -0.04 -0.03 -0.02 -0.01 0 -100 -50 0 50 100 150 200 temperature of the part ( o c) insertion loss (db) typical insertion loss (f=1880mhz) typical insertion loss (f=1990mhz) typical insertion loss (f=2170mhz) typical insertion loss (f=2600mhz) x3c19e2-20 power derating curve 0 50 100 150 200 250 300 350 400 0 50 100 150 200 mounting interface temperature ( o c) po we r (w a tts) 1400 - 2600mhz 225 9 insertion loss derating: the insertion loss, at a given frequency, of a group of couplers is measured at 25 c and then averaged. the measurements are performed under small signal conditions (i.e. using a vector network analyzer). the process is repeated at 85 c and 150 c. a best-fit line for the measured data is computed and then plotted from -55 c to 150 c. power derating: the power handling and corresponding power derating plots are a function of the thermal resistance, mounting surface temperature (base plate temperature), maximum continuous operating temperature of the coupler, and the thermal insertion loss. the thermal insertion loss is defined in the power handling section of the data sheet. as the mounting interface temperature approaches the maximum continuous operating temperature, the power handling decreases to zero.
model X3C19E2-20S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. typical performance (-55c, 25c and 95c): 1400-2700 mhz 1400 1600 1800 2000 2200 2400 2600 -70 -60 -50 -40 -30 -20 -10 0 frequency (mhz) return loss (db) return loss for X3C19E2-20S(feeding port1) 25oc -55oc 95oc 1400 1600 1800 2000 2200 2400 2600 -70 -60 -50 -40 -30 -20 -10 0 frequency (mhz) return loss (db) return loss for X3C19E2-20S(feeding port2) 25oc -55oc 95oc 1400 1600 1800 2000 2200 2400 2600 -70 -60 -50 -40 -30 -20 -10 0 frequency (mhz) return loss (db) return loss for X3C19E2-20S(feeding port3) 25oc -55oc 95oc 1400 1600 1800 2000 2200 2400 2600 -70 -60 -50 -40 -30 -20 -10 0 frequency (mhz) return loss (db) return loss for X3C19E2-20S(feeding port4) 25oc -55oc 95oc
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x3c19e2-20 rev c typical performance (-55c, 25c and 95c): 1400-2700 mhz 1400 1600 1800 2000 2200 2400 2600 -21 -20.8 -20.6 -20.4 -20.2 -20 -19.8 -19.6 -19.4 -19.2 -19 frequency (mhz) coupling (db) coupling for X3C19E2-20S(feeding port1) 25oc -55oc 95oc 1400 1600 1800 2000 2200 2400 2600 -60 -50 -40 -30 -20 -10 0 frequency (mhz) directivity (db) directivity for X3C19E2-20S(feeding port1) 25oc -55oc 95oc 1400 1600 1800 2000 2200 2400 2600 -0.2 -0.18 -0.16 -0.14 -0.12 -0.1 -0.08 -0.06 -0.04 -0.02 0 frequency (mhz) insertion loss (db) insertion loss for X3C19E2-20S(feeding port1) 25oc -55oc 95oc 1400 1600 1800 2000 2200 2400 2600 -0.2 -0.18 -0.16 -0.14 -0.12 -0.1 -0.08 -0.06 -0.04 -0.02 0 frequency (mhz) transmission loss (db) transmission loss for X3C19E2-20S(feeding port1) 25oc -55oc 95oc
model X3C19E2-20S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. definition of measured specifications parameter definition mathematical representation vswr (voltage standing wave ratio) the impedance match of the coupler to a 50 system. a vswr of 1:1 is optimal. vswr = min max v v vmax = voltage maxima of a standing wave vmin = voltage minima of a standing wave return loss the impedance match of the coupler to a 50 system. return loss is an alternate means to express vswr. return loss (db)= 20log 1-vsw r 1vswr + mean coupling at a given frequency ( n ), coupling is the input power divided by the power at the coupled port. mean coupling is the average value of the coupling values in the band. n is the number of frequencies in the band. coupling (db) = ? ? ? ? ? ? ? ? = )( )( log10)( ncpl nin n p p c mean coupling (db) = n c n n n = 1 )( insertion loss the input power divided by the sum of the power at the two output ports. 10log direct cpl in pp p + transmission loss the input power divided by the power at the direct port. 10log direct in p p directivity the power at the coupled port divided by the power at the isolated port. 10log iso cpl p p frequency sensitivity the decibel difference between the maximum in band coupling value and the mean coupling, and the decibel difference between the minimum in band coupling value and the mean coupling. max coupling (db) ? mean coupling (db) and min coupling (db) ? mean coupling (db)
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x3c19e2-20 rev c notes on rf testing and circuit layout the X3C19E2-20S surface mount couplers require the use of a test fixture for verification of rf performance. this test fixture is designed to evaluate the coupler in t he same environment that is recommended for installation. enclosed inside the test fixture, is a circuit board that is fabricated using the recommended footprint. the part being tested is placed into the test fixture and pressure is applie d to the top of the device using a pneumatic piston. a four port vector network analyzer is connected to the fixture and is used to measure the s- parameters of the part. worst case values for each parameter are found and compared to th e specification. these worst ca se values are reported to the test equipment operator along with a pass or fail flag. see the illustrations below. test board in fixture 10 & 20 db test board test station
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model X3C19E2-20S rev c the effects of the test fixture on the measured data mu st be minimized in order to accurately determine the performance of the device under test. if the line impedance is anything other than 50 and/or there is a discontinuity at the microstrip to sma interface, ther e will be errors in the data for the device under test. the test environment can never be ?per fect?, but the procedure used to build and evaluate the test boards (outlined below) demonstrates an attempt to minimize the errors associated with testing these devices. the lower the signal level that is being measured, the more im pact the fixture errors will have on the data. parameters such as return loss and isolation/directiv ity, which are specified as low as 27db and typically measure at much lower levels, will present the greatest measurement challenge. the test fixture errors introduce an uncertainty to the meas ured data. fixture errors can make the performance of the device under test look better or worse than it actually is. fo r example, if a device has a known return loss of 30db and a discontinuity with a magnitude of ?35db is introduced in to the measurement path, t he new measured return loss data could read anywhere between ?26db and ?37db. this sa me discontinuity could introduce an insertion phase error of up to 1 . there are different techniques used throughout the industr y to minimize the affects of the test fixture on the measurement data. anaren uses the fo llowing design and de-embedding criteria: ? test boards have been designed and parameters s pecified to provide trace impedances of 50 1 . furthermore, discontinuities at the sma to micr ostrip interface are required to be less than ?35db and insertion phase errors (due to differenc es in the connector interface discontinuities and the electrical line length) should be less than 0.25 from the median value of the four paths. ? a ?thru? circuit board is built. this is a two port, microstrip board that uses the same sma to microstrip interface and has the same total length (insertion phase) as the actual test board. the ?thru? board must meet the same stringent re quirements as the test board. the insertion loss and insertion phase of the ?thru? board are measured and stored. this data is used to completely de-embed the device under test from the test fixture. the de-embedded data is available in s-parameter form on the anaren website (www.anaren.com). note : the s-parameter files that are available on the ana ren.com website include data for frequencies that are outside of the specified band. it is impor tant to note that the test fixture is designed for optimum performance through 2.3ghz. some degradation in the test fixture performanc e will occur above this frequency and connector interface discontinuities of ?25db or more can be expected. this larger discontinuity will affect the data at frequencies above 2.3ghz. circuit board layout the dimensions for the anaren test board are shown below. the test board is printed on rogers ro4350 material that is 0.030? thick. consider the case when a different material is us ed. first, the pad size must remain the same to accommodate the part. but, if the material thickness or diel ectric constant (or both) ch anges, the reactance at the interface to the coupler will also change. second, the linewidth required for 50 will be different and this will introduce a step in the line at the pad where the coupl er interfaces with the printed microstrip trace. both of these conditions will affect the performance of the part. to achieve the specified performance, serious attention must be given to the design and layout of the circuit environment in which this component will be used. if a different circuit board material is used, an attempt should be made to achieve the same interface pad reactance that is present on the anaren ro4350 test board. when thi nner circuit board material is used, the ground plane will be closer to the pad yielding more capacitance for the same size interface pad. the same is true if the dielectric constant of the circuit board material is higher than is used on the anaren test board. in both of these cases, narrowing the line before the interface pad will introduce a series inductance, which, when properly tuned, will compensate for the extra capacitive reactance. if a thicker circ uit board or one with a lower dielectric constant is used,
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x3c19e2-20 rev c the interface pad will have less capacitive reactance than the anaren test board. in this case, a wider section of line before the interface pad (or a larger interface pad) will in troduce a shunt capacitance and when properly tuned will match the performance of the anaren test board. notice that the board layout for the 3db and 5db couplers is different from that of the 10db and 20db couplers. the test board for the 3db and 5db couplers has all four traces interfacing with the coupler at the same angle. the test board for the 10db and 20db couplers has two traces approachi ng at one angle and the other two traces at a different angle. the entry angle of the traces has a significant impact on the rf performance and these parts have been optimized for the layout used on the test boards shown below. 58493-0001 rev.b w=64.0 20db test board testing sample parts supplied on anaren test boards if you have received a coupler installed on an anaren produced mi crostrip test board, please remember to remove the loss of the test board from the measured data. the loss is small enough that it is not of concern for return loss and isolation/directivity, but it should ce rtainly be considered when measuring coup ling and calculating the insertion loss of the coupler. an s-parameter file for a ?thru? board (see description of ?thru? boar d above) will be supplied upon request. as a first order approximation, one s hould consider the following loss estimates: frequency band avg. ins. loss of test board @ 25 c 410 ? 500 mhz ~ 0.04db 800 - 1000 mhz ~ 0.06db 1700 ? 2300 mhz ~0.14db 2300 ? 2700 mhz ~0.155db 3300 ? 3800 mhz ~0.20db for example, a 1900mhz, 10db coupler on a test board may measure ?10.30db from input to the coupled port at some frequency, f1. when the loss of the test board is removed, the coupling at f1 becomes -10.18db (-10.30db + 0.12db). this compensation must be made to both the c oupled and direct path measurements when calculating insertion loss. the loss estimates in the table above come from room temp erature measurements. it is important to note that the loss of the test board will change with temperature. this fact must be considered if the coupler is to be evaluated at other temperatures.
model X3C19E2-20S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. peak power handling high-pot testing of these couplers during the qualification procedure result ed in a minimum breakdown voltage of 1.50kv. this voltage level corresponds to a breakdown resistance capable of handling at least 12db peaks over average power levels, for very short durations. the breakdown location consistently occu rred across the air interface at the coupler contact pads (see illustration below). the breakdown levels at these points will be affected by any contamination in the gap area around these pads. these ar eas must be kept clean for optimum performance. it is recommended that the user test for voltage breakdown und er the maximum operating conditions and over worst case modulation induced power peaking. this ev aluation should also include extrem e environmental conditions (such as high humidity). orientation marker a printed circular feature appears on t he top surface of the coupler to designate pin 1. this orientation marker is not intended to limit the use of the symmetry that these couplers exhibit but rather to facilitate consistent placement of these parts into the tape and reel package. this ensures that the components are always delivered with the same orientation. refer to the table on page 2 of t he data sheet for allowable pin configurations. test plan xinger iii 20db couplers are manufactured in large panels and then separated. a sample popul ation of parts is rf small signal tested at room temperat ure in the fixture described above. all parts are dc tested for shorts/opens. (see ?qualification flow chart? section for deta ils on the accelerated life test procedures.)
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x3c19e2-20 rev c power handling the average power handling (total input powe r) of a xinger coupler is a function of: ? internal circuit temperature. ? unit mounting interface temperature. ? unit thermal resistance ? power dissipated within the unit. all thermal calculations are based on the following assumptions: ? the unit has reached a steady state operating condition. ? maximum mounting interface temperature is 95 o c. ? conduction heat transfer through the mounting interface. ? no convection heat transfer. ? no radiation heat transfer. ? the material properties are constant over the operating temperature range. finite element simulations are made for each unit. t he simulation results are used to calculate the unit thermal resistance. the finite element simulation requires the following inputs: ? unit material stack-up. ? material properties. ? circuit geometry. ? mounting interface temperature. ? thermal load (dissipated power). the classical definition for dissip ated power is temperature delta ( t) divided by thermal resistance (r). the dissipated power (p dis ) can also be calculated as a function of the total input power (p in ) and the thermal insertion loss (il therm ): )( 101 10 w p r t p therm il in dis ? ? ? ? ? ? ? ? ??= = ? (1) power flow and nomenclature for an ?h? style coupler is shown in figure 1.
model X3C19E2-20S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. pin 1 pin 4 input port coupled port isolated port direct port p in p out (rl) p out (dc) p out (cpl) p out (iso) figure 1 the coupler is excited at the input port with p in (watts) of power. assuming the coupler is not ideal, and that there are no radiation losses, power will exit the coupler at all four port s. symbolically written, p out(rl) is the power that is returned to the source because of impedance mismatch, p out(iso) is the power at the isolated port, p out(cpl) is the power at the coupled port, and p out(dc) is the power at the direct port. at anaren, insertion loss is defined as the log of the input power divided by the sum of the power at the coupled and direct ports: note: in this document, insertion loss is taken to be a positi ve number. in many places, insertion loss is written as a negative number. obviously, a mere sign change equates the two quantities. )db( pp p log10il )dc(out)cpl(out in 10 ? ? ? ? ? ? ? ? + ?= (2) in terms of s-parameters, il can be computed as follows: )db(sslog10il 2 41 2 31 10 ? ? ? ? ? ? + ??= (3) we notice that this insertion loss value includes the power lost because of return loss as well as power lost to the isolated port. for thermal calculations, we are only interested in the power lost ?inside? the coupler. since p out(rl) is lost in the source termination and p out(iso) is lost in an external termination, they are not be included in the insertion loss for thermal calculations. therefore, we define a new insertion loss value solely to be used for thermal calculations:
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x3c19e2-20 rev c )( log10 p il ? ? ?= )()()()( 10 db pppp rlout isoout dcout cplout in therm ? ? ? ? ? ? +++ (4) in terms of s-parameters, il therm can be computed as follows: )( log10 2 2 31 2 21 2 11 10 sss il therm ? ? ? ++ ??= 41 db s ? ? ? + (5) the thermal resistance and power dissipated within the unit are then used to calculate the average total input power of the unit. the average total steady state input power (p in ) therefore is: )( 101 101 10 10 therm therm il il ? ? ? ? ? w r t p p dis in ? ? ? ? = ? ? ? ? = here the temperature delta is the circuit temperature (t circ ) minus the mounting interface temperature (t mnt ): erties of the materials used to construct the unit. ed in specific customer configurations, it is the flow or fatigue failure at the rf ports. finally, reliability is improved when the ounting interface and rf port temperatures are kept to a minimum. the power-derating curve illustra tes how change s in the mounting interface temper ature result in converse changes of the power handling of the coupler. ? ? ? ? ? ? ? (6) w )( cttt o mnt circ ?= (7) he maximum allowable circuit temperature is defined by the prop t multiple material combinations and bonding techniques are used within the xinger ii product family to optimize rf performance. consequently the maximum allowable circui t temperature varies. please note that the circuit temperature is not a function of the xinger case (top surface) temperature. therefore, the case temperature cannot be used as a boundary condition for power handling calculations. ue to the numerous board materials and mounting configuratio ns us d end users responsibility to ensure that the xinger ii coupler mounting interface temperature is maintained within the limits defined on the power derating plots for the required average power handling. additionally appropriate solder omposition is required to prevent re c m
model X3C19E2-20S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. mounting in order for xinger surface mount couplers to work optimally, there must be 50 ? transmission lines leading to and from all of the rf ports. also, there must be a very good ground plane underneath the part to ensure proper electrical performance. if either of these two conditions is not satisfied, insertion loss, coupling, vswr and isolation may not meet published specifications. overall ground is improved if a dense population of plated through holes connect the top and bottom ground layers of the pcb. this minimizes ground inductance and improves ground continuity. all of the xinger hybrid and directional couplers are constructed from ceramic filled ptfe composites which possess excellent electrical and mechanical stability having x and y thermal coefficient of expansion (cte) of 17-25 ppm/ o c. when a surface mount hybrid coupler is mounted to a printed circuit board, the prim ary concerns are; ensuring the rf pads of the device are in contact with the circuit trace of the pcb and insuring the ground plane of neither the component nor the pcb is in contact with the rf signal. mounting footprint .090 [2.29] .450 [11.43] .025 [0.64] multiple plated thru holes to ground to ensure proper electrical and thermal performance there must be a ground plane with 100% solder connection underneath the part orientated as shown with text facing up dimensions are in inches [millimeters] xc09e2-20s mounting footprint 4x 50 ? transmission line coupler mounting process the process for assembling this component is a conventional surface mount process as shown in figure 1. this process is conducive to both low and high volume usage. figure 1: surface mounting process steps storage of components: the xinger ii products are available in either an immersion tin or tin-lead finish. commonly used storage procedures used to control oxidation should be followed for these surface mount components. the storage temperatures should be held between 15 o c and 60 o c. substrate: depending upon the particular component, the circuit material has an x and y coefficient of thermal expansion of between 17 and 25 ppm/c. this coefficient minimizes solder joint stresses due to similar expansion rates of most commonly used board substrates such as rf35, ro4350, fr4, polyimide and g-10 materials. mounting to ?hard? substrates (alumina etc.) is possible depending upon operational temperature requirements. the solder surfaces of the coupler are all copper plated with either an immersion tin or tin-lead exterior finish. solder paste: all conventional solder paste formulations will work well with anaren?s xinger ii surface mount components. solder paste can be applied with stencils or syringe dispensers. an example of a stenciled solder paste deposit is shown in figure 2. as shown in the figure solder paste is applied to the four rf pads and the entire ground plane underneath the body of the part.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x3c19e2-20 rev c figure 2: solder paste application coupler positioning: the surface mount coupler can be placed manually or with automatic pick and place mechanisms. couplers should be placed (see figure 3 and 4) onto wet paste with common surface mount techniques and parameters. pick and place systems must supply adequate vacuum to hold a 0.335 gram coupler. figure 3: component placement figure 4: mounting features example reflow: the surface mount coupler is conducive to most of today?s conventional reflow methods. a low and high temperature thermal reflow profile are shown in figures 5 and 6, respectively. manual soldering of these components can be done with conventional surface mount non-contact hot air soldering tools. board pre-heating is highly recommended for these selective hot air soldering methods. manual soldering with conventional irons should be avoided.
model X3C19E2-20S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. figure 5 ? low temperature solder reflow thermal profile figure 6 ? high temperature solder reflow thermal profile
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x3c19e2-20 rev c qualification flow chart xinger iii product qualification visual inspection n=55 mechanical inspectio n n=50 solderability test n= 5 initial rf test n=50 visual inspection n = 50 v- tek testi ng n=45 visual inspection n=50 post v-tek test rf test n=50 visual inspection n= 50 solder units to test board n=25 post solder visual inspection n=25 visual inspection n=25 rf test at -55c, 25c, 95c n=20 initial rf test board mounted n=25 visual inspection n=25 post resistance heat rf test n=20 mechanical inspection n=20 voltage breakdown test mil 202f, method 301 25c 5kv n=40 visual inspection n= 50 control units rf test 25c only n=5 loose control units n= 5 resistance to solder mil 202g method 210f, condition k heat n=20 loose control units n=5 control units n= 5 loose control units n = 5
model X3C19E2-20S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. contr ol u nits n = 10 post voltage rf test n=50 therm al cycle100 cycles -55 to 125c. dwell time= 30 min n=40 visual inspection n=50 control units n=10 visual inspection n=50 bake units for 1 hour at 100 to 120c n=40 125% power life test 72 hrs n= 3 post bake rf test n=50 visual inspection n=30 microsection 3 test units 1 control final rf test @ 25c n=2 5 microsection 2 life, 1 high power and 1 control p ost mois ture resi stanc e rf test n=50 post thermal rf test n=50 m o is ture resi stanc e testi ng -25 to 65 c fo r 2 hrs @ 90% humidity. soak for 168 hrs at 90% to 85% humidity. ramp temp to 25c in 2 hrs @ 90% humidity. then soak @ -10c for 3 hrs. n=40 p ost mois ture resi stanc e rf test n=50 control units n = 10
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x3c19e2-20 rev c application information directional couplers and sampling directional couplers are often used in circuits that requi re the sampling of an arbitrary signal. because they are passive, non-linear devices, anaren directional couplers do not perturb the characteristics of the signal to be sampled, and can be used for frequency monitoring and/or measurement of rf power. an example of a sampling circuit is the reflectometer. the purpose of the reflectometer is to isolate and sample the incident and reflected signals from a mismatched load. a basic reflectometer ci rcuit is shown in figure ap.n.1-1. load 12 3 4 reflected wave v input i vv r figure ap.n.1-1. a reflectometer circuit schematic if the directional coupler has perfect di rectivity, then it is clear that v i is strictly a sample of the incident voltage v input , and v r is strictly a sample of the wave that is reflected from the load. since directivity is never perfect in practice, both v i and v r will contain samples of the input signal as well as the reflected signal. in that case, j i e v += cdtc eq. ap.n.1-1 and j r e v += ctcd eq. ap.n.1-2 where c is the coupling, d is the directivity, is the complex reflection coefficient of the load, t is the transmission coefficient, and and are unknown phase delay differences caused by t he interconnect lines on the test board. if we know v i and v r , we can easily calculate the reflection coefficient of the load. one should notice that in order to make forward and reverse measurements using only one coupler, th e directivity must be really lo w. in specific customer applications, the preferred method for forward and reverse sampling is shown in figure ap.n.1-2.
model X3C19E2-20S rev c usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. load 12 3 4 reflected wave input isolator reverse measurement measurement forward **termination *recommended terminations power (watts) model 8 rfp- 060120a15z50-2 10 rfp- c10a50z4 16 rfp- c16a50z4 20 rfp- c20n50z4 50 rfp- c50a50z4 100 rfp- c100n50z4 200 rfp- c200n50z4 figure ap.n.1-2. forward and reverse sampling the isolator in figure ap.n.1-2 prevents t he reflected wave from exciting the directional coupler. a list of recommended terminations is shown in the figure. directional couplers in feed-forward amplifier applications feed-forward amplifiers are widely used to reduce distortion due to nonlinearities in power amplifiers. although the level and complexity of feed-forward amplif iers varies from one manufacturer to another, the basic building block for this linearization scheme remains the same. a basic feed-forward sc hematic is shown in figure ap.n.2-1. the input signal is split in two using a hybrid coupler or power divider. the output of the main amplifier is sampled with a 20db-30db directional coupler. the X3C19E2-20S is an excellent candidate for this sampling since it provides great return loss and directivity. the sampled signal, which consists of a sample of the original input signal plus some distortion, is inverted and then combined with the output of the first delay line. th is procedure subtracts (through de structive interference) the sample of the original input signal, leaving only the dist ortion or error component. the error component is then amplified and combined with the output of the second delay line using another dire ctional coupler. in many cases, a 10db coupler is used to combine the two signals. the xc0900e-10 is a perfect choice for this injection because it has tight coupling, superior directivity, and excellent match.
available on tape and reel for pick and place manufacturing. usa/canada: toll free: europe : (315) 432-8909 (800) 411-6596 +44 2392-232392 model x3c19e2-20 rev c *recommended terminations power (watts) model 8 rfp- 060120a15z50-2 10 rfp- c10a50z4 16 rfp- c16a50z4 20 rfp- c20n50z4 50 rfp- c50a50z4 100 rfp- c100n50z4 200 rfp- c200n50z4 figure ap.n.2-1. generic f eed forward circuit schematic both directional couplers in the figure ap.n.2-1 have one port terminated with a 50 resistor. in order to achieve optimum performance, the termination mu st be chosen carefully. it is important to remember that a good termination will not only produce a good match at the input of the couple r, but will also maximize the isolation between the input port and isolated port. furthermore, since the termination can potentially absorb high levels of power, its maximum power rating should be chosen accordingly. a list of recommended term inations is shown in figure ap.n.2-1. for an ideal lossless directional coupler, the power at the coupled and direct ports can be written as: watts db 10 )(coupling input coupled 10 p p = eq. ap.n.2-1 watts db 10 )(coupling input input direct 10 p pp ?= eq. ap.n.2-2 where p input is the input power in watts, and coupling(db) is the coupling value in db.
usa/canada: toll free: europe: (315) 432-8909 (800) 411-6596 +44 2392-232392 available on tape and reel for pick and place manufacturing. model X3C19E2-20S rev c packaging and ordering information parts are available in a reel and as loose parts in a bag. packaging follows eia 481-2 for reels. parts are oriented in tape and reel as shown below. minimum order quantities are 2000 per reel and 100 for loose parts. see model numbers below for further ordering information. .591 [15.00] .228 [5.80] .945 [24.00] .453 [11.50] .069 [1.75] .079 [2.00] .157 [4.00] .012 [0.30] .094 [2.40] ?.059 [?1.50] ?.059 [?1.50] .315 [8.00] xinger coupler frequency (mhz) size (inches) coupling value plating finish x3c 04 = 410-500 07 = 600-900 09 = 800-1000 19 = 1700-2000 21 = 2000-2300 25 = 2300-2500 26 = 2650-2800 35 = 3300-3800 a = 0.56 x 0.35 b = 1.0 x 0.50 e = 0.56 x 0.20 l = 0.65 x 0.48 m= 0.40 x 0.20 p = 0.25 x 0.20 1 = 100 2 = 200 3 = 300 p = tin lead s = immersion tin xxx xx x x - xx x 03 = 3db 05 = 5db 10 = 10db 20 = 20db 30 = 30db power (watts) example: x3c 19 p 1 - 03 s
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